ACF Anisotropic Conductive Film

Global Leading ACF Supplier

Anisotropic Conductive Film for PCB - FOB/FOF (FPC,TCP,COF/PCB)

- High adhesion for COF & FPC
- Good contact resitance for reliability
- Good for wide bonding temperature range

Series TGP20500 TGP5000 EMA8888
Spec. Pitch Size Line um/um² 40(2.5um ball),50(3.5um ball)
Space um 40(2.5um ball),50(3.5um ball)
Thickness um 35,45 (customer options)
Length m 50,100,200,400 (customer option)
Width mm 1.2, 1.5, 2.0, 2.5 ~ (customer option)
Conductive Particle Type -- Ni
Size um 5 5 3
Density pcs/mm² 1,500 10,000
separator Film um 50/75
Pre-bonding Condition Temp °C 80±10 60±10 70±10
Time sec 1~3 0.5~3 1~2
Pressure MPa ≥1 ≥0.5 1~2
Main bonding Condition Temp °C 180~200 140~200 130~190
Time sec ≥8 ≥4 ≥4
Pressure MPa 3~4 2~5 2~5
Properties Connection Resistance Ω <1 <2
Insulation Resistance Ω >10⁹
Peel Strength gf/cm >700 >500
Repairability -- Use Acetone,MEK and general repair solution



Anisotropic Conductive Film for OLB (LCD/OLED/Hyper-Dist)

- Fine pitch interconnect : 20um fine pitch for TFT-LCD, color STN,EL
- High adhesion, high reliability, void-free bonding, and repairable by common solvents
- Low bonding temperature and quick bonding time

Series TSC5330/40 TSC4330 EMA7870
Spec. Pitch Size Line um/um² 6 8 10
Space um 14 4 10
Thickness um 16,18,25 (customer option)
Length m 50,100,200 (customer options)
Width mm ≥1.0 ~ (customer options)
Conductive Particle Type -- Au/Ni/polymer or Ni/polymer
Size um 3/4 3 3
Density pcs/mm² 5,500/7,000 15,000 6,000
separator Film um 50
Pre-bonding Condition Temp °C 50~70
Time sec 1~3
Pressure MPa 1
Main bonding Condition Temp °C 150±20 180±20 170±20
Time sec ≥4 ≥4 ≥4
Pressure MPa 3~5 3~5 3~5
Properties Connection Resistance Ω <1
Insulation Resistance Ω >10⁹
Peel Strength gf/cm >700
Repairability -- Use Acetone,MEK and general repair solution



Anisotropic Conductive Film for FOG (LCD/OLED)

- Fine pitch interconnection: 50um pitch for TFT-LCD, color STN, EL
- High adhesion, high reliability, void-free bonding, and repairable by common solvents
- Applicable for fine pitch OLB with shorter bonding time

Small-Medium Size LCD Panels Large Size LCD Panels
Series TSB21000 TSC22000 TSC5340 TSC5330/40 TSC4330 EMA7870
Spec. Pitch Size Line um/um² 50 25 25 6 8 10
Space um 50 25 25 14 4 10
Thickness um 16, 18, 25 (customer option)
Length m 50,100, 200 (customer option)
Width mm 0.8 ~ (customer option)
Conductive Particle Type -- Au/Ni/polymer Ni/polymer Au/Ni/polymer or Ni/polymer
Size um 10 4/5 4/5 3/4 3 3
Density pcs/mm² 800 5,000/4,500 7,000/6,000 5,500/7,000 15,000 6,000
separator Film um 50
Pre-bonding Condition Temp °C 60~80 50~70
Time sec 1~3
Pressure MPa 1
Main bonding Condition Temp °C 190±10 195±15 160±20 150±20 180±20 170±20
Time sec ≥8 ≥7 ≥5 ≥4 ≥4 ≥4
Pressure MPa 1.5~2 2~3 3~5
Properties Connection Resistance Ω <1
Insulation Resistance Ω >10⁹
Peel Strength gf/cm >700
Repairability -- Use Acetone,MEK and general repair solution

OLED
Series TSC22000 TSC53000
Spec. Pitch Size Line um/um² 25 8,000um²
Space um 25 11
Thickness um 18, 25 (customer option)
Length m 50, 100, 200 (customer option)
Width mm 1.0 ~ 0.8 ~
Conductive Particle Type -- Ni/polymer or Ni
Size um 5 4+3/5+3
Density pcs/mm² 4,500 7,000
separator Film um 50
Pre-bonding Condition Temp °C 70~90 60~80
Time sec 1~3 1~2
Pressure MPa 1 1~2
Main bonding Condition Temp °C 190±10 160±20
Time sec ≥8 ≥4
Pressure MPa 2.5~3 2~4
Properties Connection Resistance Ω <1
Insulation Resistance Ω >10⁹
Peel Strength gf/cm >700 >800
Repairability -- Use Acetone,MEK and general repair solution



Anisotropic Conductive Film for COG (Glass/Film/Hyper-Dist)

- Fine pitch interconnection : min. 4.5um gap for COG application
- Minimum connecting area of bump: 500um2
- High reliability and adhesion, capture rate property

Series TCG9031
Spec. Pitch Size Line um/um² 800um²
Space um 6
Thickness um 18 (customer options)
Length m 50,100(customer options)
Width mm 1.5~3.5 (customer options)
Conductive Particle Type -- Au/Ni/polymer or Ni/polymer
Size um 3
Density pcs/mm² 65,000
separator Film um 50
Pre-bonding Condition Temp °C 80
Time sec 1~2
Pressure MPa 1~2 (per unit area of ACF)
Main bonding Condition Temp °C 150±20
Time sec ≥5
Pressure MPa 40~100(per bump area of IC)
Properties Connection Resistance Ω <1
Insulation Resistance Ω >10⁹
Peel Strength gf/cm --
Repairability -- Use Acetone,MEK and general repair solution



Anisotropic Conductive Film for COP

- Fine pitch interconnection : min. 6um gap for COP application
- Minimum connecting area of bump: 600um2
- Shorting bonding time




Anisotropic Conductive Film for Camera Module

- Low bonding Temperature
- Short bonding time

Series TSB2000 TCM5000
Spec. Pitch Size Line um/um² 75(10um ball),125(20um ball)
Space um 75(10um ball),125(20um ball)
Thickness um 25,35,45 (customer options)
Length m 50,100(customer options)
Width mm 1.5~10 (customer options)
Conductive Particle Type -- Au/Ni/polymer
Size um 10/20
Density pcs/mm² 1,200/250,450
separator Film um 50
Pre-bonding Condition Temp °C 80±10 70±10
Time sec 1~3
Pressure MPa ≥1 1~3
Main bonding Condition Temp °C 190±10 155±25
Time sec ≥7 ≥6
Pressure MPa 1.5~2.0
Properties Connection Resistance Ω <1
Insulation Resistance Ω >10⁹
Peel Strength gf/cm >800
Repairability -- Use Acetone,MEK and general repair solution



Anisotropic Conductive Film for Touch (Glass/ Film)

- Low bonding Temperature
- Short bonding time

Touch Panel- Film Type Touch Panel- Glass Type
Series TGP20520 TOU2050 TCH8000 TOU5000 TOU3000 TOU8000 TOU5010
Spec. Pitch Size Line um/um² 75(10um ball),200(20um ball) 25(5um ball),75(10um ball),200(20um ball)
Space um >25/35 18/25/35
Thickness um 25/35 18/25/35
Length m 50,100, 200 (customer option)
Width mm 1.5~3.0 (customer option)
Conductive Particle Type -- Au/Ni/polymer
Size um 20 10 10/20 20 5/10/20
Density pcs/mm² 200 800 800/200 200 4,500/800/200
separator Film um 50
Pre-bonding Condition Temp °C 80±10 65±15 70±10
Time sec 1~3
Pressure MPa ≥1
Main bonding Condition Temp °C 155±5 135~160 150±10 170~190 190±20 150±20
Time sec 10~15 10~17 ≥5 8~13 10~15 ≥5
Pressure MPa <1
Properties Connection Resistance Ω <5 <1 <5 <1 <3
Insulation Resistance Ω >10⁹
Peel Strength gf/cm >500 >700 >500 >700
Repairability -- Use Acetone,MEK and general repair solution



Anisotropic Conductive Film for COF & COB & Flipchip

COF COB/ Flipchip
Series TCF7040/41 TFA22000
Spec. Pitch Size Line um/um² 1,500um² 1,500um²
Space um 15 15
Thickness um 30 (customer option)
Length m 50, 100 (customer option)
Width mm 1.0 ~ (customer option)
Conductive Particle Type -- Au/Ni/polymer
Size um 4 3/5
Density pcs/mm² 40,000 40,000/4,500
separator Film um 50
Pre-bonding Condition Temp °C 80
Time sec 1~3
Pressure MPa 1~2 (per unit area of ACF)
Main bonding Condition Temp °C 190±10 180±10
Time sec 5~10 ≥15
Pressure MPa 40~100 per bump area of IC)
Properties Connection Resistance Ω <1
Insulation Resistance Ω >10⁹
Peel Strength gf/cm >700
Repairability -- Use Acetone,MEK and general repair solution



Anisotropic Conductive Film for Fingerprint Module

- Low bonding Temperature
- Short bonding time

Series TGP5010 TSB20522F TCM5022
Spec. Pitch Size Line um/um² 75 125 125
Space um 75 125 125
Thickness um 25,35,45 (customer options)
Length m 50,100 (customer options)
Width mm 1.5 ~ 10 (customer options)
Conductive Particle Type -- Au/Ni/polymer Au/Ni/polymer+metal
Size um 10 20+8
Density pcs/mm² 800 200 & 500 200 &350
separator Film um 50
Pre-bonding Condition Temp °C 70±10 80±10 70±10
Time sec 1~3
Pressure MPa 1~2 1~3
Main bonding Condition Temp °C 140~200 180~200 130~180
Time sec ≥4 ≥7 ≥6
Pressure MPa 1.5~2.5 1.5~2.5 1~3
Properties Connection Resistance Ω <1
Insulation Resistance Ω >10⁹
Peel Strength gf/cm >700
Repairability -- Use Acetone,MEK and general repair solution

FAQ for ACF (Anisotropic Conductive Film)

Epoxy has a high modulus after curing, which is relatively suitable for hard substrates like chip/glass, while Acryl has a lower modulus after curing and is more suitable for soft substrates such as PCB / FPCB. (In terms of bonding strength)
Ni is preferred due to its relatively low cost and good conductivity. However, for applications that needs to avoid oxidation, Au-plated conductive particle are used.
In the technology of making conductive particles, the only metal that can be coated on the plastic bead is Cu / Ni.
Compared to the shape, result is more affected by the size and material of the bond pad.
Shelf-life of unopened ACF Film is 6 months under storage temperature -5 to +5 °C.

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